| 摘要 |
<p>Dual ultraviolet (UV)-heat curing adhesives requiring high temperatures greater than 120 °C to effect complete cure cannot be used on temperature sensitive substrates. The present invention provides a two-stage dual UV/heat cure composition that may cure at temperatures lower than 120 °C, for example less than 80 °C. The two-stage curable composition comprises: (a) an epoxy component; (b) a latent epoxy hardener component; (c) a cyanate ester; (d) a UV curable component; and (e) a UV initiator component. Preferred cyanate esters include the cyanate ester resin 4,4-ethylidenediphenyl diamine. Preferred UV curable components include monomers with acrylate, methacrylate, tholene or siloxane groups. Preferred latent hardeners include heat activatable hardeners including (poly)amines. The epoxy component preferably has at least two epoxy groups. Methods of bonding a first substrate to a second substrate using the adhesive composition are described and the cure product obtained from the two-stage curable composition is also claimed.</p> |
