发明名称 |
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
An upper board having an opening and forming a circuit on a surface layer, a connection sheet between boards having an opening and forming conductive holes filled with conductive paste in through-holes, and a lower board forming a circuit on a surface layer are stacked up, heated and pressed. In particular, the connection sheet between boards is made of a material different from the upper board and the lower board. A multi-layer circuit board having a cavity structure, and a full-layer IVH structure with high interlayer connection reliability can be manufactured. |
申请公布号 |
EP2164311(B1) |
申请公布日期 |
2012.04.18 |
申请号 |
EP20080763924 |
申请日期 |
2008.05.28 |
申请人 |
PANASONIC CORPORATION |
发明人 |
KITA, TAKAYUKI;KATSUMATA, MASAAKI;NAKAMURA, TADASHI;FUKASAWA, KOTA;FURUGOORI, KAZUHIRO |
分类号 |
H05K3/40;H01L21/48;H05K1/11;H05K1/18;H05K3/46 |
主分类号 |
H05K3/40 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|