| 摘要 |
A thermal coupling includes a first structure (2) having a first coefficient of thermal expansion; a second structure (14) having a second coefficient of thermal expansion lower than the first coefficient of thermal expansion; a plurality of thermal expansion fingers (7a) provided in the first structure; a plurality of thermal expansion flanges (8) extending from the plurality of thermal expansion fingers, respectively; and a flange (18) extending from the second structure and attached to the plurality of thermal expansion flanges. |
