| 摘要 |
In association with an improvement in functions of a solid state imaging device, heat generated by a solid state imaging element board becomes greater, which raises a problem of occurrence of a signal error operation. In the solid state imaging device of the present invention, a rear surface of a solid state imaging element board is molded with a resin. The mold resin has an uneven shape, whereby a radiating area is increased, a temperature rise due to generation of heat in the solid state imaging element board is prevented, and occurrence of error operation can be prevented. |
