| 摘要 |
<p>A circuit board assembly comprises: a substrate 5; a set of contact pads 6; and a plurality of discrete conductive adhesive regions disposed on the contact pads 6 and the substrate 5 such that at least one adhesive regions are disposed on and between the contact pads 6. Also disclosed is a device or module with the same features as said circuit board; and a method of providing the above circuit board assembly 1. The substrates 5 may be flexible or rigid and formed of paper, card, cardboard or plastic. The contact pads 6 may be formed of conductive ink or conductive foil. The discrete conductive adhesive regions may be formed of conductive ink, glue or tape. The discrete conductive adhesive regions may further be arranged in an array, either rectangular or hexagonal, or in a random pattern. The spacing between the contact pads 6 may be more than the maximum extent (width) of the adhesive regions, such that the adhesive regions do not create a short circuit between the contact pads 6. The circuit board assembly may comprise a printed article or part of a printed article supporting printed indicia. The present invention allows for electronic components to be incorporated into printed articles, such as books, posters and greeting cards, without requiring a conventional printed wiring board to be mounted to or inserted into the printed article.</p> |
