| 摘要 |
<p>A flexible film (100c) is provided. The flexible film includes a dielectric film (110c), a first metal layer (120c), which is formed on the dielectric film, and a second metal layer (130c), which is formed on the first metal layer, wherein the surface of the dielectric film is modified so as to provide a haze of 2-25%. Therefore, it is possible to improve the peel strength of a dielectric film with respect to a metal layer and facilitate the testing of circuit patterns on a flexible film.</p> |
