发明名称 |
INSULATING RESIN FILM, BONDED BODY USING INSULATING RESIN FILM, AND METHOD FOR MANUFACTURING BONDED BODY |
摘要 |
To provide an insulating resin film, which contains: a first adhesive layer; and a second adhesive layer, wherein the insulating resin film is configured to bond a substrate and an electronic part together, and the first adhesive layer is provided at a side of the substrate and the second adhesive layer is provided at a side of the electronic part, wherein the first adhesive layer and the second adhesive layer each contain inorganic filler, wherein the second adhesive layer has a DSC exothermic peak temperature that is higher than a DSC exothermic peak temperature of the first adhesive layer, and wherein a thickness of the first adhesive layer is 50% to 90% of a total thickness of the insulating resin film. |
申请公布号 |
KR20120036957(A) |
申请公布日期 |
2012.04.18 |
申请号 |
KR20127000578 |
申请日期 |
2010.05.20 |
申请人 |
SONY CHEMICAL & INFORMATION DEVICE CORPORATION |
发明人 |
SATO DAISUKE;NISHIMURA JUNICHI;ODAKA RYOSUKE |
分类号 |
H01L21/60;C09J7/00;C09J163/00 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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