| 摘要 |
<p>1,029,171. Semi-conductor devices. SIEMENS-SCHUCKERTWERKE A.G. Feb. 7, 1963 [Feb. 10, 1962], No. 5094/63. Addition to 1,009,359. Heading H1K. A semi-conductor device of the type described in the parent Specification in which a semiconductor element mounted between two carrier plates is enclosed in a housing comprising an insulating ring and two ductile cover plates, is provided with tapered cooling fins. As shown, cooling fins 7, 8 cut from rolled or drawn copper stock, have central apertures 7b, 8b into which are inserted copper rivets 7c, 8c which are riveted into tight contact with the fins and to provide flat surfaces at one side of the fins and concave surfaces at the other side of the fins. The semi-conductor device is mounted between a pair of fins 7, 8 with the flat surfaces of rivets 7c, 8c pressing on the ductile cover plates 4, 3 respectively, and with lens-shaped pressure bodies 9 located in the surfaces 7e, 8e of the rivets. Several assemblies as described above may be stocked to form a rectifier unit as in the parent Specification.</p> |
