| 摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to accurately manage the depth of a cavity and to offer a manufacturing process which does not influence to a circuit which is formed within the cavity in advance. CONSTITUTION: An internal circuit pattern(111) is electrically connected to a embedded circuit pattern. A base circuit substrate comprises the internal circuit pattern. A laser stopper layer is formed on the top of a cavity circuit pattern(112). At least one and more external circuit layers are formed on the base circuit substrate. A cavity area(C) is formed by eliminating the external circuit layer of the upper side of the laser stopper layer. The cavity area exposes the cavity circuit pattern to the surface of the base circuit substrate. A solder resist pattern(131) is formed between the cavity circuit patterns. An insulating layer constitutes the cavity area. The circuit pattern is exposed to the sidewall of the insulating layer.
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