| 摘要 |
A resin composition for the encapsulation of photosemiconductors, which comprises an epoxy component that contains a triglycidyl isocyanurate, an acid anhydride-type curing agent, a glycidyl -containing (meth)acrylate resin that has a weight-average molecular weight of 20000 to 65000 and a viscosity of 100 to 10000Pa·s, and a cure accelerator, and which exhibits a viscosity of 10 to 200 Pa·s and a thixotropic index of 3 to 15. |
