ADHESIVE FILM FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: Adhesive film is provided to retrain the failure of bonding wire with retraining the introduce of separate spacer between semiconductor chips, and to restrain adhesive defect like void in interface. CONSTITUTION: Adhesive film for semiconductor packaging comprises a first adhesive layer(60) in which bonding wire is penetrated and accepted, and a second bonding layer attached to a lower chip. Before hardening, the first adhesive layer has lower viscosity than the second adhesive layer. The first adhesive layer and the second adhesive layer has the viscosity difference of 10^1-10^3 poise at 100°C.