| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having high sensitivity and capable of giving a positive relief pattern free of dissolution residues of an exposed portion (scum). <P>SOLUTION: The photosensitive resin composition comprises (A) 100 parts by mass of a polymer soluble in an alkaline aqueous solution, (B) 1-100 parts by mass of a photosensitive diazonaphthoquinone compound, (C) 100-1,000 parts by mass of a diluent solvent and (D) 0.5-20 parts by mass of at least one compound represented by general formula (1). <P>COPYRIGHT: (C)2008,JPO&INPIT |
