发明名称 MULTI CHIP PACKAGE
摘要 PURPOSE: A multichip package is provided to constantly control data access time of a first semiconductor chip and a second semiconductor chip by first to N-th control signals. CONSTITUTION: A first semiconductor chip(1) generates a control signal according to a test signal or fuse cutting state in response to a test mode enable signal. A first semiconductor chip delays a first internal data by corresponding to a first delay section set by a control signal. A second semiconductor chip delays a second internal data by corresponding to a second delay section set by the control signal. A first control signal generating unit(11) generates a control signal according to a test signal if the test mode enable signal is enabled and generates the control signal according to a fuse cutting state if a test mode enable signal is disabled.
申请公布号 KR20120036436(A) 申请公布日期 2012.04.18
申请号 KR20100098101 申请日期 2010.10.08
申请人 SK HYNIX INC. 发明人 KO, BOK RIM
分类号 G11C5/06;G11C7/22;G11C29/04;G11C29/10 主分类号 G11C5/06
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