发明名称 High-frequency transmission line connection structure, circuit board, high-frequency module, and radar device
摘要 The invention relates to a high-frequency transmission line connection structure, a circuit board having the connection structure, a high-frequency module having the circuit board, and a radar apparatus. A first laminated waveguide sub-line part (21) includes a pair of main conductor layers that oppose each other in a thickness direction with a dielectric layer (31) having the same thickness as a dielectric layer (31) of a microstrip line (1) interposed therebetween. A second laminated waveguide sub-line part (22) includes dielectric layers (31, 32) thicker than the dielectric layer of the first laminated waveguide sub-line part (21). A laminated waveguide main-line part (23) includes dielectric layers (31, 32, 33) thicker than the dielectric layers of the second laminated waveguide sub-line part (22). A conversion part (10) connected to the microstrip line (1) is formed by integrating with an upper main conductor layer constituting the respective line parts.
申请公布号 US8159316(B2) 申请公布日期 2012.04.17
申请号 US20080681087 申请日期 2008.12.27
申请人 MIYAZATO KENTARO;HAYATA KAZUKI;KISHIDA YUJI;KYOCERA CORPORATION 发明人 MIYAZATO KENTARO;HAYATA KAZUKI;KISHIDA YUJI
分类号 H01P3/00 主分类号 H01P3/00
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