发明名称 |
High-frequency transmission line connection structure, circuit board, high-frequency module, and radar device |
摘要 |
The invention relates to a high-frequency transmission line connection structure, a circuit board having the connection structure, a high-frequency module having the circuit board, and a radar apparatus. A first laminated waveguide sub-line part (21) includes a pair of main conductor layers that oppose each other in a thickness direction with a dielectric layer (31) having the same thickness as a dielectric layer (31) of a microstrip line (1) interposed therebetween. A second laminated waveguide sub-line part (22) includes dielectric layers (31, 32) thicker than the dielectric layer of the first laminated waveguide sub-line part (21). A laminated waveguide main-line part (23) includes dielectric layers (31, 32, 33) thicker than the dielectric layers of the second laminated waveguide sub-line part (22). A conversion part (10) connected to the microstrip line (1) is formed by integrating with an upper main conductor layer constituting the respective line parts. |
申请公布号 |
US8159316(B2) |
申请公布日期 |
2012.04.17 |
申请号 |
US20080681087 |
申请日期 |
2008.12.27 |
申请人 |
MIYAZATO KENTARO;HAYATA KAZUKI;KISHIDA YUJI;KYOCERA CORPORATION |
发明人 |
MIYAZATO KENTARO;HAYATA KAZUKI;KISHIDA YUJI |
分类号 |
H01P3/00 |
主分类号 |
H01P3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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