| 摘要 |
A modular thermal management system that allows one or a few heat sink and fan combinations to transfer heat away from a heat zone of a variety of graphics processing cards is provided. The thermal management system includes a mounting bracket configured to attach to the graphics processing card in thermal contact with the heat zone, the mounting bracket having a first opening that corresponds to a processor in the heat zone, a heat sink configured to attach to the mounting bracket, wherein the heat sink overlies the first opening and is in thermal contact with at least a portion of the processor through the first opening, and a fan configured to attach to the mounting bracket adjacent the heat sink. |
