发明名称 |
Method of forming metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds |
摘要 |
A leadframe for the assembly of a semiconductor chip has regions (112) with an original smooth surface of glossy appearance and regions (113, 114, 210) of a frosty appearance with rough surface contours. The regions of rough surface contours include two-dimensional arrays of spots (401) comprising a central area (402) below the original surface (400) and a piled ring (403) above the original surface. The piled ring (403) consists of the leadframe material in amorphous configuration.
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申请公布号 |
US8158460(B2) |
申请公布日期 |
2012.04.17 |
申请号 |
US201113239082 |
申请日期 |
2011.09.21 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
ABBOTT DONALD C |
分类号 |
H01R9/00;H01L21/00;H01L23/495 |
主分类号 |
H01R9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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