发明名称 Electronic component fabrication method using removable spacers
摘要 A method of fabricating an electronic component is provided. The method includes placing a plurality of electrodes in a stack. Spacing between adjacent electrodes in the stack is determined by one or more removable spacers. The method further includes bonding adjacent electrodes together to fix the spacing and removing the spacers from between the adjacent electrodes.
申请公布号 US8156622(B2) 申请公布日期 2012.04.17
申请号 US20100692122 申请日期 2010.01.22
申请人 CHEUNG WILLIAM S. H.;YEN TECHNOLOGIES, LLC 发明人 CHEUNG WILLIAM S. H.
分类号 H01G7/00 主分类号 H01G7/00
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