| 摘要 |
PURPOSE: A stacking type LED package and manufacturing method thereof are provided to form an independent heat radiating structure at each unit package, thereby quickly and efficiency radiating heat. CONSTITUTION: A first step substrate comprises a first step package insulating layer(9) and a first step package conductive film(10). A heat radiating plate(15) with a heat radiating fin(14) is formed on the lower surface or a side of the first step substrate. A first light emitting diode is laminated on a fixed area of the first step substrate. At least two bump layers(5) are laminated on both ends of the first step substrate. A second step substrate is smaller than the size of the top of the first step substrate.
|
