发明名称 |
Optical element package and method of manufacturing the same |
摘要 |
An optical element package includes: an optical element in a form of a chip, and a lens resin having a convex lens surface covering an optical functional surface of the optical element. The convex lens surface is formed as a rough surface having a plurality of minute convex curved surfaces having a vertex in a direction perpendicular to a plane in contact with each part of the convex lens surface.
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申请公布号 |
US8158997(B2) |
申请公布日期 |
2012.04.17 |
申请号 |
US20100693188 |
申请日期 |
2010.01.25 |
申请人 |
FUKASAWA HIROYUKI;TANAKA TSUTOMU;SONY CORPORATION |
发明人 |
FUKASAWA HIROYUKI;TANAKA TSUTOMU |
分类号 |
H01L33/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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