发明名称 Optical element package and method of manufacturing the same
摘要 An optical element package includes: an optical element in a form of a chip, and a lens resin having a convex lens surface covering an optical functional surface of the optical element. The convex lens surface is formed as a rough surface having a plurality of minute convex curved surfaces having a vertex in a direction perpendicular to a plane in contact with each part of the convex lens surface.
申请公布号 US8158997(B2) 申请公布日期 2012.04.17
申请号 US20100693188 申请日期 2010.01.25
申请人 FUKASAWA HIROYUKI;TANAKA TSUTOMU;SONY CORPORATION 发明人 FUKASAWA HIROYUKI;TANAKA TSUTOMU
分类号 H01L33/00 主分类号 H01L33/00
代理机构 代理人
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