发明名称 |
Interconnection method for tightly packed arrays with flex circuit |
摘要 |
Exemplary embodiments provide interconnects and methods for interconnecting an electrical device array with a flexible circuit by filling a chemically-etched or laser-ablated integral stencil with conductive materials. |
申请公布号 |
US8156641(B2) |
申请公布日期 |
2012.04.17 |
申请号 |
US20090470047 |
申请日期 |
2009.05.21 |
申请人 |
MASSOPUST DAN LEO;ANDREWS JOHN RICHARD;SLENES CHAD J.;XEROX CORPORATION |
发明人 |
MASSOPUST DAN LEO;ANDREWS JOHN RICHARD;SLENES CHAD J. |
分类号 |
H05K3/30 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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