发明名称 |
Sputtering target fixture |
摘要 |
A method and apparatus for sputter deposition. The method including: providing a sputter target having a back surface and an exposed front surface; providing a source of magnetic field lines, the magnetic field lines extending through the sputter target from the back surface to the exposed front surface of the sputter target; providing one or more pole extenders between magnetic poles of the source of the magnetic field lines and the exposed front surface of the sputter target. |
申请公布号 |
US8157970(B2) |
申请公布日期 |
2012.04.17 |
申请号 |
US20080166958 |
申请日期 |
2008.07.02 |
申请人 |
MURPHY WILLIAM J.;STRIPPE DAVID C.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MURPHY WILLIAM J.;STRIPPE DAVID C. |
分类号 |
C23C14/35 |
主分类号 |
C23C14/35 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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