METHOD OF MANUFACTURING A CHIP-EMBEDDED MULTI-LEVEL PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method for manufacturing a chip embedded multilayer printed circuit board is provided to implement a thin multilayer circuit without an additional laminating process by forming the multilayer circuit within the thickness range of an embedded chip. CONSTITUTION: A coreless carrier is formed by successively laminating a first material layer(110a,110b) and a second material layer(120a,120b) on both sides of a bonding sheet(100). A pad(130a,130b) is formed by processing a second material layer of the coreless carrier. An inner layer(160a,160b) is formed by forming a copper foil on both sides of the insulation layer. A cavity and a copper foil circuit are formed in an inner layer. The second material layer with the component is separated from the first material layer and the bonding sheet.