THE RADIANT HEAT CIRCUIT BOARD AND THE HEAT GENERATING DEVICE PACKAGE HAVING THE SAME

摘要

PURPOSE: A heat dissipation circuit board and a heat generating device package including the same are provided to improve heat dissipation properties by forming heat dissipation protrusions into one body. CONSTITUTION: A metal plate(110) includes an integrated metal protrusion. An insulating layer(140) exposes the integrated metallic protrusion. The insulating layer is arranged on the metal plate. A plurality of electrode pads is formed on the insulating layer. The electrode pads apply voltage to each heat generation device(200).