发明名称 CUTTING APPARATUS FOR SILICON LAYER OF GLASS PANEL
摘要 PURPOSE: A cutting apparatus for silicon layer of glass panel is provided to cut steadily a silicon layer by image of the edge of a reinforced glass panel. CONSTITUTION: A cutting apparatus for silicon layer of glass panel includes a bed(10), a photographing module(20), a image reading module(30), a cutting module(40). The bed forms the placing space of the reinforced glass panel having a silicon layer(110). The photographing module gets the read image taking a photograph of the glass panel. The image reading module detects the read image, the edge(101) of the glass panel. The cutting module enforces cut the edge of a silicon layer. The light irradiating unit(21) examining the light in the toughened glass panel is installed in the photographing module. The image reading module detects the edge of the glass panel through the light refracted according to the edge of the glass panel.
申请公布号 KR20120035339(A) 申请公布日期 2012.04.16
申请号 KR20100096795 申请日期 2010.10.05
申请人 EYESPI CO., LTD.;OH, JU HWAN;LEE, TAI SONG 发明人 LEE, TAI SONG;OH, JU HWAN
分类号 B23K26/38;B23K26/70;G01N21/00;H01L31/042 主分类号 B23K26/38
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