| 摘要 |
<p>There are provided electronic parts with excellent strength and high insulation resistance. According to a preferred embodiment, the electronic part comprises an inner layer section and outer layer sections formed covering the surfaces of the inner layer section, wherein the inner layer section and outer layer sections have a construction with a filler component dispersed in a glass component, the transverse strength of the inner layer section is at least 330 MPa, and the inner layer section has a thermal expansion coefficient larger than that of the outer layer sections.</p> |
