| 摘要 |
The present invention provides a method for processing substrate made of brittle material. A crackle which penetrates into the inner part of substrate can be reliably formed at the correct position along a preset dividing line. The method for processing substrate made of brittle material uses a heating step and a cooling step for forming the crackle. The heating is executed with a mode that the beam spot (BS) moves relatively along the preset dividing line (P) according to the heating step. The cooling is executed with a mode that the cooling spot moves relatively along the track for scanningthe beam spots according to the cooling step. The cooling step comprises the following procedures executed sequentially: (a) a first cooling procedure for relatively moving the first cooling spot (CS1) which is reduced to smaller than the width of beam spots along with the beam spot thereby extending the shallow crackle (S2); and (b) a second cooling procedure for relatively moving the second cooling spot (CS2) which is extended to larger than the width of the beam spot along with the track for scanning the first cooling point, thereby penetrating the shallow crackle formed beforehand in the thickness direction of substrate.
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