发明名称 SOLDERING METHOD OF METAL PRINTED CIRCUIT BOARD AND FLEXIBLE CIRCUIT AND SOLDERING APPARATUS THEREOF
摘要 PURPOSE: A method and a device for welding a metal PCB and a flexible circuit are provided to absorb the heat of solder fused in a soldering process or an iron tip since a heating plate is mounted in a jig. CONSTITUTION: A first junction part of a metal PCB is installed on the upper part of the heating plate mounted in a jig(S1). A second junction part of a flexible circuit is installed on the upper part of the jig for the contact with the first junction part of the metal PCB(S2). The metal PCB heats the heating plate to the prescribed temperature(S3). The metal PCB is welded with the flexible circuit by soldering the second junction part of the flexible circuit(S4). The heating plate is heated at the temperature of 50-400°C.
申请公布号 KR101134171(B1) 申请公布日期 2012.04.13
申请号 KR20110143907 申请日期 2011.12.27
申请人 SONG HO 发明人 JEONG, KI SEONG
分类号 H05K3/36;H05K1/14 主分类号 H05K3/36
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