<p>PURPOSE: A method for manufacturing a printed circuit board is provided to prevent the printed circuit board to be bent by processing both sides grinding process of an upper side substrate or a lower side substrate after a separation process of a carrier member. CONSTITUTION: First metal foil(12) is formed in both sides of an insulating layer(11). Adhesive(13) formed into a thermoplastic resin is formed on the upper side of the first metal foil. Second metal film(14) is formed on the upper side of the adhesive. Resist having an opening is formed in both sides of a carrier absence(10) in order to form a metal post. A metallic coating layer forming the metal post is formed in the opening. The surface of the resist is ground. The insulating layer is laminated after eliminating the resist. The surface of the insulating layer is ground.</p>
