| 摘要 |
PURPOSE: A heat dissipation circuit board and a manufacturing method thereof are provided to use a metal plate which includes a heat dissipation protrusion on the lower part of a mounting pad, thereby directly transferring heat emitted from a heating device to the metal plate. CONSTITUTION: A heat dissipation circuit board(100) comprises a metal plate(10), an insulating layer arranged on the metal plate, and a circuit pattern(40) arranged on the insulating layer. The metal plate is made of an alloy including copper with high thermal conductivity, aluminum, nickel, gold, platinum, and etc. The metal plate comprises a metallic protrusion(11) on which a heating device(60) is mounted. The insulating layer comprises a first insulation layer(20) and a second insulation layer(30). The first insulation layer functions as a bonding layer for attaching the second insulation layer forming an upper part to the metal plate forming a lower part. A plurality of circuit patterns is arranged on the second insulation layer. The circuit pattern is formed by patterning a conductive layer that is laminated on the second insulation layer.
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