| 发明名称 |
WOOD FILM AND FORMIG METHOD FOR THE SAME |
| 摘要 |
<p>PURPOSE: A wood film and a molding method thereof are provided to maintain a state of being attached to a surface of an electronic equipment case. CONSTITUTION: A wood film comprises a veneer film(11), a nonwoven fabric(12), and a resin film(13). The veneer film is composed of wood. The non-woven fabric is attached to rear side of the veneer film. The wood film includes a resin film attached to rear side of the non-woven fabric. The non-woven fabric is attached using urethane group adhesive to the veneer. The resin film includes polycarbonate film. The resin film is attached to rear side of the non-woven fabric using moisture curing polyurethane adhesive.</p> |
| 申请公布号 |
KR20120034953(A) |
申请公布日期 |
2012.04.13 |
| 申请号 |
KR20100096357 |
申请日期 |
2010.10.04 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
BA, EAH HYUN;SON, SANG IK;JIN, JAE CHUL;HONG, SEOK HYUN;PARK, HOON SOO |
| 分类号 |
B32B21/04;B32B7/12;B32B27/28;B32B37/00 |
主分类号 |
B32B21/04 |
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