METHOD OF SETTING SUCTION PRESSURE OF PICKER WHICH PICKS AND TRANSFERS SEMICONDUCTOR ELEMENT

摘要

PURPOSE: A suction pressure setting method for a picker apparatus of a semiconductor device and an apparatus and sample device used in the same are provided to minimize flip-chip bending deformation during the transmission of a scrapped flip-chip. CONSTITUTION: A sample device including an electric resistance body is prepared in a sample device preparing step(S110). The electric resistance body varies the electric resistance value according to an amount of bending deformation of the sample device. A wheaston bridge circuit is comprised using an electric resistance body in a circuit composition step(S120). The sample device is griped by introducing suck pressure to an inlet of a picker apparatus when supplying power to the wheaston bridge circuit in a sample device scrapping step(S130). The suck pressure is determined in order to set proper deformation of the sample device by detecting the deformation of sample device through a bridge voltage measurement of the wheaston bridge circuit while varying the suck pressure(S160).