发明名称 MICROMACHINING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To quickly micromachine an object with high accuracy. <P>SOLUTION: A machining head 4 of the micromachining apparatus includes a diffraction grating type spatial light modulation device 41 having a plurality of movable ribbons 413a and fixed ribbons arranged alternately on a substrate 411, and a plurality of cutting blades 42 projecting from the plurality of movable ribbons 413a of the spatial light modulation device 41 toward a holding part 3. In the machining head 4, by rising/lowering of the plurality of moving ribbons 413a, the plurality of cutting blades 42 individually come in contact with and separate from a cutting face 91 of the object 9, and with the cutting blades 42 in contact with the cutting face 91, by the object 9 being moved, micromachining is performed. In the micromachining apparatus, by controlling rising/lowering of the movable ribbons 413a with high accuracy, micromachining of the object 9 can be performed quickly and with high accuracy. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012071464(A) 申请公布日期 2012.04.12
申请号 JP20100217157 申请日期 2010.09.28
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 OGAWA HIDEAKI
分类号 B29C59/02;B29C33/38 主分类号 B29C59/02
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