| 发明名称 |
INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME |
| 摘要 |
In various embodiments, an electronic module features a first cavity in a first side of a substrate, a fill hole extending from the first cavity, and a second cavity in a second side of the substrate. The second cavity is in fluidic communication with the fill hole, and a die is encapsulated within the second cavity.
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| 申请公布号 |
US2012086135(A1) |
申请公布日期 |
2012.04.12 |
| 申请号 |
US201113267703 |
申请日期 |
2011.10.06 |
| 申请人 |
THOMPSON JEFFREY C.;RACZ LIVIA M.;TEPOLT GARY B.;LANGDO THOMAS A.;MUELLER ANDREW J. |
发明人 |
THOMPSON JEFFREY C.;RACZ LIVIA M.;TEPOLT GARY B.;LANGDO THOMAS A.;MUELLER ANDREW J. |
| 分类号 |
H01L23/28;H01L21/56 |
主分类号 |
H01L23/28 |
| 代理机构 |
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