| 摘要 |
A forming mold having a base member, a resin layer bonded to the base member and serving as a forming surface, and a bonding layer between the base member and the resin layer, which bonds the base member to the resin layer. The base member has a rigidity higher than that of the resin layer. The forming mold is produced through bonding the resin layer to the base member by use of an adhesive, and the surface of the bonded resin layer is worked, to form the“forming surface”of the resin layer. Alternatively, the forming mold is produced through forming the resin layer having a“forming surface”and bonding the formed resin layer to the base member by use of an adhesive. The present invention enables provision of a forming mold having enhanced dimensional precision of the resin layer actually serving as a forming surface.
|
