发明名称 |
HEAT DISSIPATION DEVICE AND RADIO FREQUENCY MODULE WITH THE SAME |
摘要 |
A heat dissipation device and a radio frequency module with the same are provided. The heat dissipation device includes a substrate (1). The substrate (1) having a surface where a heat absorbing surface (5) is formed. There are multiple hollow conduits inside the substrate (1) to act as evaporating conduits (6). The heat dissipation device further comprises condensing conduits (7) intercommunicated with the evaporating conduits (6). The evaporating conduits (6) and the condensing conduits (7) form sealed conduits. The sealed conduits are filled with liquid which vaporizes upon heating. At least the evaporating conduits (6) are set in the substrate (1). |
申请公布号 |
US2012087090(A1) |
申请公布日期 |
2012.04.12 |
申请号 |
US201113327059 |
申请日期 |
2011.12.15 |
申请人 |
FENG TAQING;LI ZHIJIAN;HONG YUPING;CHEN HONGLIANG;SHI JIAN |
发明人 |
FENG TAQING;LI ZHIJIAN;HONG YUPING;CHEN HONGLIANG;SHI JIAN |
分类号 |
H05K7/20;F28D15/02 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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