发明名称 |
SYSTEM AND METHOD FOR WAFER BACK-GRINDING CONTROL |
摘要 |
In a system or method for controlling wafer back-grinding, a chuck table has a surface for supporting a semiconductor wafer during a back-grinding process, one or more holes in the surface, and one or more sensors disposed in the one or more holes for monitoring a parameter during back-grinding. A computer-implemented process control tool is coupled to receive one or mote outputs from the one or more sensors and control the back-grinding process based on the received one or more outputs. |
申请公布号 |
US2012088316(A1) |
申请公布日期 |
2012.04.12 |
申请号 |
US20100900683 |
申请日期 |
2010.10.08 |
申请人 |
LU CHEN-FA;LEE CHIANG-HAO;CHEN WEI-YU;LIU CHUNG-SHI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LU CHEN-FA;LEE CHIANG-HAO;CHEN WEI-YU;LIU CHUNG-SHI |
分类号 |
H01L21/66;G06F17/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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