| 摘要 |
<p>Provided are: a heat-conductive adhesive agent comprising an adhesive resin and a heat-conductive filler, wherein the heat-conductive filler comprises plate-shaped metal particles; an adhesive sheet which has, formed on at least one surface thereof, an adhesive agent layer comprising the heat-conductive adhesive agent; and an lighting device comprising a substrate having a light-emitting element mounted thereon and a heat sink, wherein an adhesive agent layer comprising a heat-conductive adhesive agent is intercalated between the substrate and the heat sink. The heat-conductive adhesive agent can be used suitably, for example, for bonding a wiring substrate to a member for which heat-releasing properties are required, such as a heat sink and a housing.</p> |
