发明名称 CUTTING BLADE AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a cutting blade or the like, capable of lowering stress generated in a green sheet laminate in cutting and suppressing the occurrence of delamination of the laminate in cutting. <P>SOLUTION: The cutting blade cuts the green sheet laminate having a plurality of multilayer ceramic green sheets. In the cutting blade: the blade surface has first, second, and third regions arranged in order from the cutting edge toward the ridge; the first region has a first angle formed to the center line of the thickness direction of the cutting blade; the second region has a second angle which is smaller than the first angle formed to the center line; the third region has a third angle which is smaller than the second angle formed to the center line; arithmetic mean roughness Ra of the first, second, and third regions is &le;0.1 &mu;m; and the distance from the crossing point of the extensions of the first and the third regions to the second region is &le;5 &mu;m. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012071374(A) 申请公布日期 2012.04.12
申请号 JP20100217025 申请日期 2010.09.28
申请人 TDK CORP 发明人 HOSOGAYA RYUJI;SEKI MASUJIRO;TOMONO OSAMU;HARANO MITSUYOSHI
分类号 B26D1/06;H01G4/12;H01G4/30 主分类号 B26D1/06
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