| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet that can be used as a dicing tape in a dicing process and as an adhesive agent with an excellent connection reliability in a bonding process between a semiconductor element and a supporting member, and that has a heat resistance and a moisture resistance required when the semiconductor element is mounted on the supporting member for mounting a semiconductor, and that has an excellent workability. <P>SOLUTION: An adhesive sheet has an adhesive agent layer additionally provided with an adhesive agent on a base material film. The adhesive sheet has positioning means for positioning a wafer on the adhesive agent layer or the base material film. One or more layers are laminated on one or both of a circuit surface and a rear face of a precut wafer or a wafer having portions processed to be easily cut, and then the wafer having the portions processed to be easily cut is divided and used for a process for obtaining chips with the adhesive sheet. The adhesive agent layer is cut preliminarily so as to be smaller in size than the cut chips. <P>COPYRIGHT: (C)2012,JPO&INPIT |
