WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BONDING OF WIRE BONDS
摘要
Methods and systems are described for enabling the efficient fabrication of wedge bonding of integrated circuit systems and electronic systems. In particular a reverse bonding approach can be employed.
申请公布号
WO2012018474(A3)
申请公布日期
2012.04.12
申请号
WO2011US43184
申请日期
2011.07.07
申请人
NATIONAL SEMICONDUCTOR CORPORATION;PHAM, KEN;NGUYEN, LUU, T.