| 摘要 |
<p>The objective of the present invention is to provide a method of manufacturing a printed circuit board having a good adhesion characteristic between faces of an insulation resin layer and a solder resist layer, even when the surface roughness of the insulation resin layer exposed between circuits is not so rough. In order to achieve this objective, a method of manufacturing a printed circuit board using a copper-clad laminate having non-roughened copper foils pasted together is adopted. The method of manufacturing a printed circuit board is characterized in forming circuits by etching the non-roughened copper foils with copper-etching liquid, then implementing cleanup processing on insulation resin surfaces exposed between the circuits, and characterized, upon conducting a semi-quantitative analysis of surface-treatment metal components of the non-roughened copper foils remaining on the insulation resin surfaces that had cleanup processing implemented thereupon, with an XPS analysis apparatus (X-ray source: A1(Ka), acceleration voltage: 15 kV, beam diameter: 50 µm), in making the amount of each of the surface-treatment metal components to be not more than the detection limit.</p> |
