| 摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to prevent the degradation of reliability due to stress concentration by selectively inserting an insulating member. CONSTITUTION: A printed circuit board comprises a pad(3), a solder paste(4) formed on the pad, an electric component(5) installed on the solder paste. The printed circuit board comprises a first insulation layer(6) which buries the electric component, a first circuit pattern(8) formed on both sides of the first insulation layer, a second insulation layer(10) formed on the first insulation layer. The printed circuit board comprises a third insulation layer(12) formed under the first insulation layer, a second circuit pattern(13) formed on the second insulation layer and the third insulation layer, a solder resist(16) which buries the second circuit pattern. The first insulation layer protects the electric component buried in the printed circuit board.
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