| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a communication device having improved antenna characteristics by decreasing coupling capacitance generated between an antenna and the communication device. <P>SOLUTION: A communication device includes an antenna, a semiconductor chip, and a substrate, on which first to fourth wires are formed and the semiconductor chip is mounted. The substrate has first to fourth substrate main surface electrodes and first to fourth substrate rear surface electrodes. At least one of the first to third wires has an extension wire for plating processing extended to the substrate edge. At least one of the fourth wires has no extension wire for plating processing extended to the substrate edge. The antenna is offset from the center on the semiconductor chip and provided at one of four corners of the semiconductor chip or one of four sides of the semiconductor chip. The extension wire for plating processing is provided at a corner or a side where the antenna is not provided, and formed by extending at least one of the first to third wires to the substrate edge. <P>COPYRIGHT: (C)2012,JPO&INPIT |
