MANUFACTURING DEVICE OF ELECTRONIC COMPONENT PACKAGING BODY

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing device of an electronic component packaging body capable of preventing a faulty packaging body from occurring by compensating an out-of-place error that occurs in the electronic component during or after the electronic component adsorption.

SOLUTION: A manufacturing device of an electronic component packaging body used to supply an electronic component Ch onto a base member F on which an electronic circuit is formed comprises: a base member conveyance part 1 which conveys the base member F; and an electronic component supply part 2 which supplies the electronic component Ch onto the base member F. The electronic component supply part 2 comprises: a conveyance path 211 which conveys the electronic component Ch; transfer means 22 which adsorbs the conveyed electronic component Ch and transfers the conveyed electronic component Ch onto the base member F; and compensation means 23 which compensates the out-of-place error of the electronic component Ch during the period from when the electronic component Ch is separated from the conveyance path 211 by suction force of the transfer means 22 to when the electronic component Ch is supplied onto the base member F.

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