| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a package substrate for mounting a semiconductor element, by which a fine outer layer circuit having adhesion can be formed, and improvement in yield and connection reliability with the semiconductor element can be ensured. <P>SOLUTION: A method of manufacturing a package substrate for mounting a semiconductor element includes the following steps of: laminating a multilayer metal foil 9 and a base material 16 to form a core substrate 17; peeling a first carrier metal foil 10 of the multilayer metal foil 9 physically; performing pattern plating 18 onto a second carrier metal foil 11 and laminating an insulation layer to form a lamination body; separating the lamination body together with the second carrier metal foil 11 from the core substrate 17; performing etching so that a surface of the pattern plating 18 forms a recess to a surface of the insulation layer; and performing noble metal plating onto the recess to flatten the surface of the insulation layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
