发明名称 FOAM RESIN MOLDING DIE AND FOAM RESIN MOLDED PRODUCT
摘要 <P>PROBLEM TO BE SOLVED: To provide a foam resin molding die capable of more uniformly sending vapor to inside of a molding cavity compared to conventional cases. <P>SOLUTION: In the foam resin molding die, a material feeder 10 is provided on a first molding face 3, and a plurality of vapor holes 8 are formed on first and second molding faces 3, 4. Foamable resin particles are filled in the molding cavity 6 from the material feeder 10, and vapor is brought into contact with the filled foamable resin particles via the plurality of vapor holes 8, so as to mold a foam resin molded product. When the material feeder 10 is arranged on the first molding face 3, a portion of the second molding face 4 opposing to a material input port 11 of the material feeder 10 is designed to have the vapor hole 8 all the time. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012071542(A) 申请公布日期 2012.04.12
申请号 JP20100219672 申请日期 2010.09.29
申请人 SEKISUI PLASTICS CO LTD 发明人 YAMADA HIROHISA
分类号 B29C44/00;B29C33/04;B29K105/04 主分类号 B29C44/00
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