METHOD OF MANUFACTURING A BASE PLATE FOR MOUNTING SEMICONDUCTOR ELEMENTS

摘要

PURPOSE: A method for manufacturing a substrate for mounting a semiconductor device are provided to improve adhesion with resin by forming a plating layer with a reverse trapezoid cross section. CONSTITUTION: An opening with a preset pattern is formed in a top resist layer(41). A surface of a metal plate(20) is partially exposed by a bottom resist layer(31) which is not exposed. The bottom resist layer is exposed and hardened. A preset plating is formed on the surface of the metal plate exposed from the bottom resist layer. The top resist layer and the bottom resist layer are delaminated.