| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a soldering paste that makes possible a surface mounting structure for electronic components that can withstand 1,000 heat shock cycles of -40 to 150°C as required for use in the proximity of engines for vehicular applications without cracking in the solder joint parts. <P>SOLUTION: Flux containing an amine halogen salt and dicarboxylic acid is kneaded into a Sn-Ag-Bi-In alloy powder. As a result, a soldering paste with superior bondability and no cracking for 1,000 heat shock cycles of -40 to 150°C that has long continuous printability and less occurrence of solder balls is obtained. <P>COPYRIGHT: (C)2012,JPO&INPIT |
