| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of alleviating heat stress when a large current is energized using a post-shaped electrode and surely connecting the post-shaped electrode to an electrode of a semiconductor chip. <P>SOLUTION: A metal particle protected by organic coating is applied to at least one of bonding surfaces of a front-surface electrode of a semiconductor chip 1 and a post electrode 15, pressure and heat is applied between the front-surface electrode of the semiconductor chip and the post electrode 15, and the organic coating is broken to expose the metal particle and actively connect the metal particle to the bonding surfaces, thereby connecting the front-surface electrode and the post electrode. <P>COPYRIGHT: (C)2012,JPO&INPIT |
