| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve reliability of electric connection between conductive layers. <P>SOLUTION: A first conductive layer 3 formed on one surface 2a of a first insulation layer 2 is electrically connected to a second conductive layer 4 formed on the other surface 2b through a first interlayer connection part 7 formed by filling a conductive material 6 in a first via hole 5. A second insulation layer 2 is laminated on a surface of the first insulation layer 2 where the second conductive layer 4 is formed, and a third conductive layer 9 is formed on a surface of the second insulation layer 2, which is opposite to the first insulation layer 2. A second interlayer connection part 12 is formed by filling a conductive paste 11 in a second via hole 10 and a recessed part 7a formed in the first interlayer connection part 7, and the first to third conductive layers 3, 4, and 9 are electrically connected with each other through the first and second interlayer connection parts 7 and 12. <P>COPYRIGHT: (C)2012,JPO&INPIT |
